Technical Data Sheet
24K Brush Plating Gold Solution
Gold Plating Services’ 24K Brush Gold Plating Solution is cobalt hardened acid gold electroplating solution that will yield a relatively low stress, fine grained deposit with hardness range of 130-200 Knoop. This solution is ideally suited for printed circuit boards fingers, contacts, fine select applications as well as jewelry and other decorative deposits.
The purity and hardness of the final electrodeposited gold will be equivalent to Type I, and II, Grade C, specifications as indicated in MIL-G-45204C, & MIL-DTL-45204D as follows;
Content- Varies – standard solution contains ~2.5 grams per 280grams solution ~ (8.5oz)
Purity - 99.7 percent gold minimum, (24 karat), Type I & II
Hardness - Knoop hardness 130-200, Grade C
Density of Plate - 12.64 mg/in˛/µm thick
Theoretical Coverage ~ 1200 in˛/8oz solution to an average thickness of 10 micro-inches (0.25µm).
Note: this coverage is based on the assumption that all gold in the solution will be deposited.
In actual practice this is not likely since there is normally solution loss during use.
|Operating Temperature||Room to 110° F||80° F|
|Anode Voltage||3 - 6 VDC||4 VDC|
|Current Density||5 - 20 ASF||10 ASF|
|Anode||Type 316 SS or platinized titanium||Type 316 SS|
|Agitation||Circular, in small circles with low sleeve pressure keeping fresh solution between sleeve and work.|
|Read & understand MSDS before using: request MSDS via e-mail|
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